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本文介绍了一种新开发的不含卤和磷等阻燃添加剂的高阻燃性玻纤-环氧树脂覆铜板。这种覆铜板主要是由自熄性环氧树脂化合物(酚基芳烷烃类)、不可燃气体发生剂(氨基-三嗪-诺瓦拉克型固化剂,ATN型固化剂)、无机填料如炭化促进剂(钼酸锌滑石粉,ZMT)及一定量的无害金属氢氧化物如氢氧化铝(ATH)等组成。这种覆铜板有良好的阻燃性,并且耐浸焊性、耐潮湿性、电性能优良,加工性能也很好,这些好的性能使这种新型板材足可以代替现在广泛应用的FR-4印制电路基材。在覆铜板制造中同时应用ATN型固化剂和ZMT,与自熄性环氧树脂化合物、ATH等协同作用,大大地提高了阻燃性能;减少了ATH的用量,有利于改进耐浸焊性、耐潮湿性和电性能。
This article describes a newly developed non-halogen and phosphorus flame retardant additives, such as high flame retardant glass fiber - epoxy copper clad laminate. This CCL is mainly composed of self-extinguishing epoxy compounds (phenolalkylalkanes), non-flammable gas generating agents (amino-triazine-novalac curing agent, ATN curing agent), inorganic fillers such as carbonization Accelerator (zinc molybdate talc, ZMT) and a certain amount of harmless metal hydroxides such as aluminum hydroxide (ATH) and other components. The CCL has good flame retardancy, and solderability, moisture resistance, electrical properties, processing performance is also very good, these good performance so that the new plate enough to replace the now widely used FR-4 printing Circuit substrate. At the same time in the manufacture of CCL ATN curing agent and ZMT, and self-extinguishing epoxy compounds, ATH and other synergies, greatly enhance the flame retardant properties; reduce the amount of ATH, is conducive to improving the solder-immersion resistance, resistance Humidity and electrical properties.