“摩尔定律”准确地预测了半导体集成化的发展趋势,在过去几十年间,半导体硅片上集成的晶体管的数目越来越多,半导体硅片的功能也越来越复杂,从原来相对单一的微处理器、DSP或ASSP、ASIC向集成数字、模拟、存储器、3D封装的融合硅片方向发展。在这种融合的发展趋势下,FPGA器件也在发生着变化,正在不断集成更多的功能:在FPGA的可编程架构下,单 “Moore’s Law ” accurately predicted the trend of semiconductor integration, in the past few decades, more and more integrated transistors on the semiconductor silicon, the function of semiconductor silicon is also more and more complex, from the original Relatively single microprocessor, DSP or ASSP, ASIC to integrated digital, analog, memory, 3D package of fused silicon development. In this convergence of trends, FPGA devices are also changing, are continuing to integrate more functions: In the FPGA programmable architecture, single