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无压烧结SiC陶瓷(SSiC)是重要的高温结构材料,连接技术是扩大其应用范围的关键技术之一。将活性填料纳米Ni粉添加到聚硅氧烷SR355中制成连接材料,通过反应成形连接工艺连接SSiC。研究了纳米Ni粉对SR355的裂解过程和陶瓷产率的影响,同时也研究了填料含量和连接温度对连接件强度的影响。结果表明,纳米Ni粉的加入促进了SR355的裂解并提高了其陶瓷产率。当纳米Ni粉含量为1%(质量分数)、连接温度为1050℃时,连接件经3次浸渍增强处理后的连接强度达到最大值。微观结构研究表明,连接层均匀致密,且与母材间界面结合良好,界面处发生了元素的扩散,纳米Ni粉在连接过程中参与了化学反应并促进了界面结合。
Pressureless Sintered SiC Ceramics (SSiC) is an important high-temperature structural material. Connection technology is one of the key technologies to expand its application range. The active filler nano-Ni powder was added into the polysiloxane SR355 to make the connecting material, and the SSiC was connected by the reactive forming connection process. The effect of nano-Ni powder on the cracking process and ceramic yield of SR355 was studied. At the same time, the effect of filler content and connection temperature on the strength of the connector was also studied. The results showed that the addition of nano-Ni powder promoted the cracking of SR355 and enhanced its ceramic yield. When the content of Nano-Ni powder is 1% (mass fraction) and the connection temperature is 1050 ℃, the connection strength reaches the maximum after 3 times of impregnation. Microstructure studies show that the bonding layer is uniform and compact, and the interface with the base metal is well bonded. The diffusion of the elements occurs at the interface. The nano-Ni powder participates in the chemical reaction during the bonding and promotes the interfacial bonding.