电子设备比几年前增加了许多功能,“片上系统”成为满足更高的电路复杂性和可靠性以及降低成本的需求的解决方案。 “片上系统”是指在同一个封装内组装两个集成电路的封装方法。这种新的封装方法满足了所有的单片集成电路解决方案无法满足的应用需求,特别是那些功率要求不断提高而专用的热设计的成本不能提高的交流-直流变流器、大功率系统和高压系统。 As electronic devices add many more features than a few years ago, “system on a chip” has become the solution to the demands of higher circuit complexity and reliability, and lower costs. “System on a chip” refers to the packaging method of assembling two integrated circuits in the same package. This new packaging method addresses all of the unmet application needs of any monolithic solution, especially those with increased power requirements and the cost of dedicated thermal designs that can not be increased, such as AC-DC converters, high-power systems and High-pressure system.