在半导体工业奋力的去迎接明日的封装需求挑战之际,倒装芯片技术无疑将扮演一个重要的角色。为了达到更高的可靠性、更低的成本以及在更小尺寸的封装空间里进行更密集的装配以及更高速度的混合电路的回路,传统的芯片-金线连接方式必须改为倒装芯片的连接技术。倒装芯片封装有以 Flip-chip technology will undoubtedly play an important role in the semiconductor industry struggling to meet tomorrow's packaging needs challenge. In order to achieve higher reliability, lower cost, and more densely packed and higher speed hybrid circuits in smaller package sizes, traditional chip-to-gold connections must be flipped to flip chip Connection technology. Flip chip package with