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本发明公开了一种传感器装配封装系统及装配封装方法,该系统集显微镜、机械手、键合工艺平台等设备于一体,通过控制机构控制机械手运作,先将管座放置于键合工艺平台上固定,然后将芯片安装于管座上,最后实现键合封装。通过采用两个显微镜分别对管座与芯片的位姿进行确认,实现芯片与管座间的自动对位、装配,降低传感器制作过程中对作业员的要求,提高工作效率,同时保证芯片与管座间的有效定位,提升成品率。应用该系统可以实现复杂MEMS微结构在一台机器上同时实现传感器组件的装配与键合封装的集成操作,实现传感器生产的自动化。
The invention discloses a sensor assembly and packaging system and an assembly and packaging method. The system integrates equipment such as a microscope, a robot and a bonding technology platform, and controls the operation of the robot through a control mechanism. The tube base is first placed on a bonding process platform and fixed , And then the chip is mounted on the stem, the final bonding package. By adopting two microscopes respectively to confirm the position and the position of the tube base and the chip, the automatic alignment and assembly between the chip and the base are realized, the requirement for the operator in the sensor manufacturing process is reduced, the working efficiency is improved, and the chip and the tube Block between the effective positioning to improve the yield. The application of the system can realize the integrated operation of the complicated MEMS micro-structure to realize the assembly of the sensor component and the bonding package on one machine at the same time, and realize the automation of the sensor production.