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采用称为纳米孔互连导通孔基板(INPS)的新方法开发了具有无焊盘导通孔的新型挠性印制板。INPS板的特点在于无焊盘导通孔、微细电路、可挠性和可分开的线路。
A new flexible printed circuit board with padless vias has been developed using a new method known as nanopore interconnect via substrate (INPS). The INPS board features pad-less vias, tiny circuitry, flexibility and detachable circuitry.