日前,碳化硅(SiC)技术全球领导者半导体厂商Cree宣布推出采用SiC材料可使感应加热效率达到99%的Vds最大值为1.2KV、典型值为5.0mΩ半桥双功率模块CAS300M12BM2。该款产品目标用途包括感应加热设备、电机驱动器、太阳能和风能逆变器、UPS和开关电源以及牵引设备等。CAS300M12BM2外壳采用行业标准的62mm×106mm×30mm,封装则采用Half-Bridge Module,具有超低损耗、高频率特性以及易于并联等特点。漏极 Recently, Cree, the world leader in silicon carbide (SiC) technology, announced the launch of the CAS300M12BM2, a half-bridge dual-power module with a typical maximum of 1.2KV and a typical value of 5.0mΩ. The product’s intended use includes induction heating equipment, motor drives, solar and wind inverters, UPS and switching power supplies, and traction equipment. The CAS300M12BM2 is housed in an industry standard 62mm × 106mm × 30mm package and is available in a Half-Bridge Module package featuring ultra-low loss, high frequency characteristics and ease of paralleling. Drain