针对应用最为广泛、可靠的光纤光栅(FBG)埋入式封装,进行了光纤光栅标准化封装设计的理论和实验研究。通过对光纤应变传递分析模型的边界条件和变形协调条件,以及现有主要应变传递特征方程的分析,构造静定应变传递特征方程,得到光纤光栅封装结构统一的应变传递关系,从而建立光纤光栅标准化埋入式封装设计统一的基本理论模型。对封装元件的实验测试结果表明,基于经典剪滞理论及Ansari应变传递分析模型得到的理论模型,对由较低模量的粘接材料构成的封装元件的设计和分析较为可靠。 For the most widely used and reliable FBG embedded package, the theoretical and experimental research on the standardized package design of FBG is carried out. Through the analysis of the boundary conditions and the deformation coordination of the model, and the analysis of the existing principal strain transfer characteristic equations, the static strain transfer characteristic equation is constructed and the uniform strain transfer relationship of the FBG package structure is obtained, so as to establish the standardization of the FBG Embedded package design unified basic theoretical model. Experimental results on the package components show that the design and analysis of package components made of lower modulus adhesive materials are more reliable based on the theoretical model obtained from classical shear lag theory and Ansari strain transfer analysis model.