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A method based on the theory of transfer matrix to design the integrated microlens for the collimation of vertical-cavity surface emitting laser(VCSEL) array is presented.The integrated microlenses fabricated on the substrate directly and on a certain polymer material which is on the substrate are considered.The relationships between the radius of curvature,beam waist and the divergence angle after collimation are obtained with the help of ZEMAX.The results show that the devices with the divergence angle of 15°(1/e2) and beam waist of 2 μm can be improved to those with the divergence angle lower than 1°,and the devices with beam waist of 10 μm can be improved to those with the divergence angle lower than 3°,which is a good reference for manufacturing high-power devices with small divergence angle.The conclusions including increasing the thicknesses of both the substrate and polymer material and reducing the diameter of oxidized layer are drawn,which will be an important guidance for experiment research.
A method based on the theory of transfer matrix to design the integrated microlens for the collimation of vertical-cavity surface emitting laser (VCSEL) array is presented. The integrated microlenses fabricated on the substrate directly and on a certain polymer material which is on the substrate are considered. The relationships between the radius of curvature, beam waist and the divergence angle after collimation are obtained with the help of ZEMAX. The results show that the devices with the divergence angle of 15 ° (1 / e2) and beam waist of 2 μm can be improved to those with the divergence angle lower than 1 °, and the devices with beam waist of 10 μm can be improved to those with the divergence angle lower than 3 °, which is a good reference for manufacturing high-power devices with small divergence angle.The conclusions include increasing the thicknesses of both the substrate and polymer material and reducing the diameter of oxidized layers are drawn, which will be an important guidance f or experiment research.