根据微机电系统(MEMS)在承压能力与化学稳定性方面的要求,在国外文献的基础上配制得到一种作为Si-聚酰亚胺(PI)低温键合黏合剂的芳香类热固性共聚酯(ATSP)。使用ATSP在不同条件下对Si-PI进行低温键合,确定了适合ATSP键合的温度和压力条件,并对键合面的拉伸强度和化学性能进行测试。测试结果表明,Si-PI键合面的拉伸强度能够达到1.3 MPa以上,完全可以满足MEMS器件在承压能力方面的要求。同时,键合后的ATSP在丙酮、酒精、制冷剂R134a和1-甲基-2-吡咯烷酮等多种试剂中均具有良好的化学稳定性。 According to the requirements of pressure-bearing capacity and chemical stability of MEMS, a kind of aromatic thermosetting copolymerization of low temperature bonding agent of Si-polyimide (PI) was prepared on the basis of foreign literature Ester (ATSP). ATSP was used to bond Si-PI under different conditions to determine the temperature and pressure conditions suitable for ATSP bonding. The tensile strength and chemical properties of the bonding surface were tested. The test results show that the tensile strength of Si-PI bonding surface can reach more than 1.3 MPa, which can fully meet the requirements of MEMS devices in pressure bearing capacity. At the same time, the bonded ATSP has good chemical stability in many reagents such as acetone, alcohol, refrigerant R134a and 1-methyl-2-pyrrolidone.