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光子晶体光纤端面研磨过程中存在着大量磨粒切削光纤包层的空气孔壁。将这一过程简化为单颗磨粒切削单孔壁,并应用有限元法(FEM)建立了数值仿真模型。分析了裂纹损伤产生的机理,以及不同切削深度和磨粒尖端半径对加工结果的影响。仿真结果表明:切削过程中,孔壁边缘容易出现沿圆周分布的崩塌区域;切削力和边缘崩塌区域随切削深度和磨粒尖端半径的增加而增加;该光子晶体光纤孔壁边缘无崩塌的最大切削深度约为20nm。该方法对光子晶体光纤端面加工及耦合应用的研究具有重要意义。
Photonic crystal fiber end grinding process there is a lot of abrasive cutting fiber cladding air hole wall. This process is simplified as single abrasive grain cutting single hole wall, and the numerical simulation model is established by finite element method (FEM). The mechanism of crack damage was analyzed, and the influence of different cutting depths and abrasive tip radius on machining results was analyzed. The simulation results show that the edge of the hole wall tends to be distributed along the circumference during the cutting process. The cutting force and the edge collapse area increase with the cutting depth and the radius of the tip. The maximum of the edge of the hole wall of the PCF does not collapse Cutting depth of about 20nm. This method is of great significance to the research of photonic crystal fiber end processing and coupling application.