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利用扫描电镜、强度测试仪分析了高纯铜线与微Sn合金铜线不同热处理温度下组织结构及强度、伸长率的差异,研究了高纯铜线、微Sn合金铜线再结晶行为及微量合金元素Sn对高纯铜线再结晶温度的影响机理。结果表明:Sn原子与铜原子间的化学交互作用与弹性交互作用,引起高纯铜的点阵畸变,阻碍再结晶过程中铜的晶界迁移,抑制再结晶和晶粒长大,使微Sn合金铜线再结晶温度由高纯铜线的400℃提高至450℃,且高纯铜线在热处理过程中晶粒增长与热处理时间呈四次方关系;微量Sn合金减少了无空气焊球热影响区长度,热影响区长度由150μm减少至120μm。
The microstructures, strength and elongation at different heat treatment temperatures of high-purity copper wire and micro-Sn alloy copper wire were analyzed by scanning electron microscope and intensity tester. The recrystallization behavior of high-purity copper wire and micro-Sn alloy copper wire were studied. Influence Mechanism of Trace Alloying Element Sn on Recrystallization Temperature of High Purity Copper Wire. The results show that the chemical interaction between Sn atoms and copper atoms interacts with the elasticity and causes the lattice distortion of high pure copper, hinders the migration of copper during grain recrystallization, inhibits recrystallization and grain growth, The recrystallization temperature of alloy copper increased from 400 ℃ to 450 ℃ for high purity copper wire, and the relationship between the grain growth and the heat treatment time of high purity copper wire showed a quadratic relationship during the heat treatment. The trace Sn alloy reduced the airless solder ball heat Affected zone length, heat-affected zone length reduced from 150μm to 120μm.