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Atmel和CS2两家公司最近宣布合作开发和实现业界领先的薄膜互连技术,可以在单一衬底上集成多个晶圆片和无源元件,其性能大大超过前一代的互连技术,并且已经在频率达50GHz时得到验证。 采用这项技术后Atmel公司可以将它的CMOS和硅锗(SiGe)晶圆片连同非易失存储器和模拟器件集成在
Atmel and CS2 recently announced a partnership to develop and implement industry-leading thin-film interconnect technology that integrates multiple wafers and passive components onto a single substrate that outperforms previous generations of interconnect technology and that has been Verified at frequencies up to 50GHz. With this technology, Atmel can integrate its CMOS and SiGe wafers with nonvolatile memory and analog components