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引言 在许多应用中,电子设备往往是由装配有小型元件的印制板组装而成。这些印制板一个个相互平行地依次安装在导槽之上,导槽又安装在组装结构板上。在某些情况下,组装体是密闭的,板间无气流直接通过。这时,在印制板上安装有电子元件的一边可以敷一层导热金属,如铜或铝,以形成热接地板。此金属板从导槽槽口中和元件下面通过,并同导槽接触,以此将元件产生之热通过印制板和导槽傳至结
Introduction In many applications, electronic devices are often assembled from printed boards assembled with small components. These printed boards are mounted one above the other in parallel to each other on a guide rail, which in turn is mounted on the mounting structure board. In some cases, the assembly is hermetically sealed and there is no airflow between the plates. At this time, a side of the printed circuit board on which the electronic components are mounted may be coated with a heat conductive metal, such as copper or aluminum, to form a thermal ground plane. The metal plate passes under the slot of the guide slot and under the element and comes into contact with the slot so that the heat generated by the element is transmitted to the junction through the printed board and the guide slot