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界面材料不完全填充固体界面间隙时,界面热阻R_j由两部分组成:界面材料和固体接触处的接触热阻Rc及间隙内的气体热阻Rg。界面热阻R_j难以测量,建立有效模型准确地预测界面热阻十分重要。基于界面化学模型,建立了一个针对填充具有流体性质的界面材料的界面热阻模型。比较发现界面热阻模型的预测值比界面化学模型的预测值与实验值更加吻合。分析表明:残留在间隙内的气体热阻Rg在界面材料导热系数k_(TIM)较大时不能忽略;界面热阻Rj随固体界面粗糙度σ的增大而增大,随界面材料导热系数kTIM的减小而增大。
Interface material is not fully filled with solid interface gap, the interface thermal resistance R_j consists of two parts: interface material and the solid contact at the contact resistance Rc and gas gap Gage Rg. The interface thermal resistance R_j is difficult to measure. It is very important to establish an effective model to accurately predict the thermal resistance of the interface. Based on the interface chemistry model, an interface thermal resistance model for filling the interface material with fluid properties was established. It is found that the predicted values of the interface thermal resistance model are more consistent with the predicted values of the interface chemistry model and the experimental values. The analysis shows that the thermal resistance Rg of the residual gas in the gap can not be neglected when the thermal conductivity k_ (TIM) of the interface material is relatively large. The interface thermal resistance Rj increases with the increase of the solid interface roughness σ, Increase and decrease.