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高可靠的弹上电子产品在加速寿命试验中存在高成本、小子样的问题,难以采用传统的加速应力设计方法,为此提出了一种基于系统可靠度与失效物理的弹上电子产品加速环境谱设计方法。首先,基于系统可靠度的概念,提出了串并联系统加速因子的估计方法,通过系统可靠度建模,推导出板级电子产品加速因子估计模型,修正了基于串联假设的板级电子产品加速因子估计存在的不足;然后,在研究失效物理模型的基础上,推导出加速应力转化模型,建立了常规应力与加速应力的等效转换关系;最后,梳理出弹上电子产品加速环境谱设计流程。以某型导弹时序控制电路板为例,对其加速温度谱进行了分析与设计,并给出了受试产品剩余寿命评估方法,从而验证本文方法的工程适用性。
Highly reliable on-the-fly electronic products have high cost and small sample problems in accelerated life test, so it is difficult to adopt the traditional method of accelerating stress design. Therefore, an accelerated environment based on system reliability and failure physics is proposed Spectral design method. Firstly, based on the concept of system reliability, an estimation method of accelerating factor in series-parallel system was proposed. Through the system reliability modeling, the accelerating factor estimation model of board-level electronic products was deduced. The acceleration factors of board-level electronic products Then, based on the study of the failure physics model, the accelerated stress transformation model is deduced and the equivalent conversion between the normal stress and the acceleration stress is established. Finally, the design flow of the accelerated environment spectrum of the bomb-on-electronic product is summarized. Taking a type of missile sequential control circuit board as an example, the accelerated temperature spectrum was analyzed and designed. The residual life assessment method of the tested product was given to verify the engineering applicability of this method.