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并行集束型半导体装备的性能分析和产能预测是一项非常困难的任务,建立装备性能模型是解决这一问题的有效方法之一。首先用时序图描述了集束型半导体装备加工腔体和机械手在稳态阶段的使用情况,根据建立的时序图,推导出装备稳态时加工约束与传输约束的边界条件。然后,分别给出了不同约束条件下装备的稳态加工过程时序图,并推导出了装备的吞吐量模型。该模型反映了并行集束型半导体装备配置参数对吞吐量的影响,利用该模型可以高效地计算装备吞吐量、辅助系统设计。最后,进行仿真实验,分析了处理时间对装备吞吐量的影响。
Parallel cluster semiconductor equipment performance analysis and capacity prediction is a very difficult task, to establish equipment performance model is one of the effective ways to solve this problem. First, the use of the processing chamber and manipulator of the cluster semiconductor equipment in the steady-state phase is described with a timing diagram. According to the established time-series diagram, the boundary conditions of the machining constraint and the transmission constraint in the steady state of the equipment are deduced. Then, the steady-state process sequence charts of the equipment under different constraints are given respectively, and the throughput model of the equipment is deduced. The model reflects the influence of the configuration parameters of parallel cluster semiconductor devices on the throughput, which can be used to calculate the equipment throughput efficiently and assist the system design. Finally, simulation experiments were conducted to analyze the influence of processing time on equipment throughput.