在模拟工况条件下 ,研究了成分、温度及孔洞对 Ti (C,N)基金属陶瓷热冲击疲劳裂纹扩展速率的影响。结果发现 :随着ΔT或 Ni含量的增加 ,该材料的热冲击裂纹扩展孕育期缩短 ,且生长速率上升 ;热疲劳裂纹的扩展往往是依靠基体孔洞之间的不断连通形成 ,并且始终是沿着能量最低的方向扩展 Under simulated working conditions, the effects of composition, temperature and pores on the thermal shock fatigue crack growth rate of Ti (C, N) -based cermets were investigated. The results show that as the content of ΔT or Ni increases, the thermal shock crack growth period of the material shortens and the growth rate increases. The thermal fatigue crack growth often depends on the continuous communication between the matrix holes and is always along The direction of the lowest energy expansion