本文描述目前高性能、高密度ＩＣ封装的现状、面临的问题以及未来封装的发展趋势。指出了未来封装将朝着表面安装技术（ＳＭＴ）乃至九十年代的新技术──多芯片组件（ＭＣＭ）发展；分析了有关美、日对发展封装技术的策略；提出了对我国发展封装业的建议和对策。 This article describes the current status of high-performance, high-density IC packages, problems they face and trends in future packaging. It points out that the future packaging will move toward the new technology of surface mount technology (SMT) and the nineties ─ ─ the development of multi-chip module (MCM); the analysis of the United States and Japan on the development of packaging technology strategy; the development of China’s packaging industry Suggestions and countermeasures.