1.激光增强电镀属于液相激光化学沉积,它也是一种可以不用掩模而直接制作微细金属原图的新技术。美国IBM公司及其他一些研究部门从七十年代末开始在这一方向进行了一系列研究。近年来我们对激光增强电镀的机理和规律作了实验探讨,观察到电镀的激光增强效应,实验得到的激光电镀速率为0.1～1μm/s量级,比无激光照射时的常规电镀速率高600～1200倍。利用这一新技术我们得到了直径(宽度)为数十微米的铜镀点和镀线。 1. Laser enhanced plating is a liquid-phase laser chemical deposition, it is also a new technology that can directly produce the original microgranules without a mask. IBM and some other research departments in the United States started a series of studies in this direction from the late 1970s. In recent years, we have made an experimental discussion on the mechanism and rule of laser enhanced electroplating. The laser enhancement effect of electroplating is observed. The experimental laser electroplating rate is in the order of 0.1 ~ 1μm / s, which is 600 higher than the conventional electroplating rate without laser irradiation ~ 1200 times. Using this new technology, we have obtained copper plating spots and plating lines of tens of microns in diameter (width).