未来超级本包含的技术,将允许用户在PC周围放置手机和其他设备即可实现充电。而磁共振感应(Resonant magnetic induction),或称磁耦合谐振(Resonant inductive coupling)就是这样一种无线传送功率的方式,其在两个线圈之间形成共振,从而实现电能的无线传输。虽然无线充电技术已发展多年,但事实上一直未能成为市场主流。日前,英特尔和IDT(Integrated Device Technology)宣布达成合作,为英特尔的无线充电技术共同开发集成发射器和接收器芯片。该方案将利用共振技术,使置于PC周围的设备以无线的方式 Future Super includes technology that will allow users to place their cell phones and other devices around their PCs for charging. Resonant magnetic induction, or Resonant inductive coupling, is a method of wirelessly transmitting power that resonates between two coils to achieve wireless transmission of electrical energy. Although wireless charging technology has been developed for many years, it has in fact been unable to become the mainstream of the market. Recently, Intel and IDT (Integrated Device Technology) announced an agreement to jointly develop integrated transmitter and receiver chips for Intel’s wireless charging technology. The program will use resonant techniques to place devices placed around the PC wirelessly