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引言 商用的无线通信应用要求使用低成本的基板材料,它应具有正确的介电常数(±1～2％)以及低的介电损耗(损耗因子小于0.005)。需要高性能层压板的典型应用在500兆赫以上,比如蜂窝寻呼系统的线性功率放大器、蜂窝电话手机滤波器以及卫星直播站的低噪声阻塞下变频器等。迄今为止,设计师必须在材料性能和加工的难易之间采取折衷。这里要介绍的新材料将在这一鸿沟之间架设一座桥梁,使能用标准的电路板加工工艺来得到优良的电性能。
Introduction Commercial wireless communication applications require the use of low cost substrate materials that should have the correct dielectric constant (± 1 to 2%) and low dielectric loss (loss factor less than 0.005). Typical applications requiring high performance laminates are above 500 MHz, such as linear power amplifiers for cellular paging systems, cell phone handset filters, and low noise blocking downconverters for satellite broadcast stations. To date, designers must take the trade-off between material properties and ease of processing. The new materials to be introduced here will bridge the gap by enabling the use of standard circuit board processes for superior electrical performance.