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微波电路组装是通过使用微带传输线和芯片元件来实现小型化。一般采用聚四氟乙烯—玻缡纤维微带介质以及镀覆的铝外壳。电路的隔离通过机加工的腔体来实现。
Microwave circuit assembly is achieved through the use of microstrip transmission lines and chip components to achieve miniaturization. General Teflon - glass fiber microstrip media and coated aluminum housing. Circuit isolation is achieved through machined cavities.