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高性能集成电路要求改进封装设计和封装材料，以便适应更高I／O密度和工作电压的需求。封装材料之间的粘结问题，对于维护封装在各种环境条件下的完善性和工作性能是头等重要的。本文对影响粘结性能和界面完善性的诸多因素进行了概述。专门举例讨论了TBGA封装结构中存在的一些界面，并介绍了几种分析方法及粘结测量技术的应用。
High-performance integrated circuits require improved package design and packaging materials to accommodate the needs for higher I / O density and operating voltage. The problem of bonding between packaging materials is paramount to maintaining the integrity and performance of the package under a variety of environmental conditions. This article provides an overview of the many factors that affect the bond performance and interface integrity. Some examples of the interfaces that exist in the TBGA package structure are specifically discussed, and the application of several analysis methods and bond measurement techniques are introduced.