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制作了模块化的形状记忆合金丝夹层,提出形状记忆合金丝驱动夹层与蜂窝结构蒙皮的集成方法。对形状记忆合金丝进行加热,由于夹层内形状记忆合金丝排布方式的不同,可分别实现蜂窝蒙皮后掠与上反。研究嵌入驱动器夹层后的蜂窝结构蒙皮的主动变形能力。结果表明,在激励电流为3 A时,蜂窝蒙皮试件可上反5.1°或后掠8°。这种通过蒙皮自身产生的变形能够降低变体机翼蒙皮变形对驱动力的要求。
A modular shape memory alloy wire sandwich was fabricated and an integrated method of shape memory alloy wire driven sandwich and honeycomb structure skin was proposed. The shape memory alloy wire is heated. Because of the different shape arrangement of the shape memory alloy wire in the interlayer, the honeycomb skin can be swept and reversed respectively. Study the active deformability of honeycomb structure skin embedded in driver sandwich. The results show that the honeycomb skin specimen can be turned 5.1 ° or 8 ° backwards when the excitation current is 3 A. This deformation by the skin itself can reduce the deformation of the wing deformation of the driving force requirements.