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(一) 简述由于电子元器件引线可焊性不好,使得整机厂在组装前不得不对元器件进行刮脚和二次浸锡,因而耗费了大量的工时和材料,降低了生产效率。据有关资料介绍:以1983年为例,全国电子工业由于刮脚和二次浸锡,每年要浪费近350吨锡,连同工时费,每年给国家造成的直接经济损失达7000余万元。由于可焊性不好,还影响了电子元器件的出口;影响了整机的可靠性等。针对下述情况,电子工业部组织了全国引线可焊性技术攻关。 (二) 引线线材的一般镀层及其可焊性浅析: 为了提高线材的可焊性,我厂线材可焊性攻关小组做了大量的试验工作。首先是对可焊性机理进行了一定深度的探讨。然后,对国内外现有的镀涂
(A) a brief description Due to the poor solderability of electronic components lead, making the whole plant had to scratch the components before assembly and secondary immersion tin, thus consuming a lot of man-hours and materials, reducing production efficiency. According to relevant information: In 1983, for example, the national electronics industry wiped out nearly 350 tons of tin per year due to the scraping of the feet and the secondary dip of tin. Together with the working hour fee, the direct economic loss caused to the country amounted to more than 70 million yuan each year. Due to poor solderability, but also affect the export of electronic components; affect the reliability of the machine. In response to the following circumstances, the Ministry of Electronics Industry organized national lead solderability research. (B) Lead wire general coating and solderability analysis: In order to improve the solderability of wire, I plant wire solderability research team did a lot of testing work. The first is a discussion of the solderability mechanism to a certain depth. Then, the existing plating at home and abroad