晶片球接点排列(fpBGA)塑胶集成块已经在表面组装技术(SMT)工业中占有一席之地,市场预测它在未来几年还会继续增长。一般而言,fpBCA在线路连接脚(lead)的数目相同时能做到比四边平面集成块(QFP)有更小的线路节点(footprint)。此外,fpBGA也明显降低了器材在运送过程中遭到损坏的风险,减少了功率噪声,性能表现与有线路连接脚的集成块不相上下甚而更为出色。随着对高密度、高输入/输出集成块的需求日益增长,fpBGA正迅速成为新 The chip ball contact array (fpBGA) plastic block has a place in the surface mount technology (SMT) industry and the market is predicting it will continue to grow in the coming years. In general, fpBCA achieves a smaller footprint than quad flat packs (QFPs) when the number of line leads is the same. In addition, fpBGA also significantly reduces the risk of damage to the equipment during shipping, reduces power noise, and performance is comparable to or better than a block with line-connecting feet. With the increasing demand for high-density, high-input / output manifolds, fpBGA is rapidly becoming new