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研究了Ti含量和保温时间对Cu-Ti钎料在Al2O3陶瓷上润湿性的影响。结果表明,保温时间40 min时,Cu-Ti钎料在Al2O3陶瓷上的润湿角最小。随着Ti含量的增加,Cu-Ti钎料在Al2O3陶瓷上的润湿角减小。当Ti含量低于25%时,Cu-Ti钎料对Al2O3陶瓷不浸润。采用电子探针显微镜以及电子能谱仪分析界面的微观结构与成分,分析认为,钎料在陶瓷上的浸润性与活性元素在陶瓷中生成的化合物有关。
The effect of Ti content and holding time on the wettability of Cu-Ti solder on Al2O3 ceramic was investigated. The results show that the wetting angle of Cu-Ti solder on Al2O3 ceramic is the smallest when holding time is 40 min. With the increase of Ti content, the wetting angle of Cu-Ti solder on Al2O3 ceramic decreases. When Ti content is less than 25%, Cu-Ti brazing filler metal is not wetting Al2O3 ceramics. The microstructure and composition of the interface were analyzed by electron probe microscope and electron spectrometer. The analysis showed that the wettability of the solder on the ceramic was related to the compound of the active element in the ceramic.