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片子的自动对准和自动装卸提高了探针装置的工作效率并改进了成品率。日本的半导体厂商都己把这些全自动探针系统纳入了他们的自动化器件制造计划中。而美国的半导体厂商在这方面则起步较晚。
The automatic alignment and autoloading of the film improves the efficiency of the probe device and improves the yield. Japanese semiconductor manufacturers have incorporated these fully automated probe systems into their automated device manufacturing plans. However, the semiconductor manufacturers in the United States started late in this area.