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THICK FILM CIRCUITS most commonly involve the screen printing process of forming a functional composition through a patterned mesh screen onto glasses.Of ceramics. The printed film is dried and fired, typically in the range of 500 to 900 ℃ (930 to 1650°F) to sinter the film and adhere it ro the substrate with the desired characteristics for circuit applications. The functional compositions in general include conductors, resistors, and dielectrics. The dielectrics may be used as overglazes, crossovers, capacitors, or multilayers. The term thick film originated from the term thin film. Thin films are deposited by vacuum technology, either by evaporation or sputtering. In the early 1960s, the Bell Tele-
THICK FILM CIRCUITS most commonly involve the screen printing process of forming a functional composition through a patterned mesh screen onto glasses. Of ceramics. The printed film is dried and fired, typically in the range of 500 to 900 ° C (930 to 1650 ° F) to sinter the film and adhere it ro the substrate with the desired characteristics for circuit applications. The functional compositions in general include conductors, resistors, and dielectrics. The dielectrics may be used as overglazes, crossovers, capacitors, or multilayers. The term thick film originated from the term thin film. Thin films are deposited by vacuum technology, either by evaporation or sputtering. In the early 1960s, the Bell Tele-