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采用自主研发的碱性铜抛光液,在E460E机台上研究了不同磨料质量分数对铜和钽抛光速率与膜厚一致性的影响;分析了磨料质量分数为2%,2.8%和3.6%时,膜厚一致性对平坦化的影响。抛光结果显示:当磨料质量分数高于2.8%时,抛光液开始对钽进行有效的抛光;随着磨料浓度的增加,抛光液的膜厚一致性提高趋于平缓。磨料质量分数为2.8%和3.6%时,抛光后膜厚一致性变好,碟形坑满足工业生产要求;磨料质量分数为2%时,抛光后膜厚一致性比抛光前恶化,碟形坑相对较大。由此可见,当磨料质量分数为2.8%时,抛光液能有效去除残余铜,并且抛光后膜厚一致性好,有利于实现平坦化,尤其是对提高成品率和优品率有重要的作用。
The effects of different abrasive mass fractions on copper and tantalum polishing rate and film thickness consistency were studied on an E460E machine using an alkaline copper polishing solution developed independently. The effects of different abrasive mass fractions on the uniformity of film thickness were analyzed. When the abrasive mass fractions were 2%, 2.8% and 3.6% , The consistency of the film thickness on the impact of flattening. Polishing results show that when the abrasive mass fraction is higher than 2.8%, the polishing solution begins to polish the tantalum efficiently. With the increase of the abrasive concentration, the consistency of the polishing solution tends to be flat. When the abrasive mass fraction is 2.8% and 3.6%, the uniformity of film thickness becomes better after polishing, and the dishing pit meets the requirements of industrial production. When the mass fraction of abrasive is 2%, the uniformity of film thickness after polishing is worse than that before polishing, relatively bigger. Thus, when the abrasive mass fraction of 2.8%, the polishing solution can effectively remove the residual copper, and consistency of the thickness of the film after polishing is conducive to achieving flatness, in particular, to improve the yield and excellent rate of an important role .