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含铜量高的 Al-Cu-Mg 系铝合金很难阳极氧化形成厚膜,原因是铝合金中析出的 S(CuMgAl_2)相及 CuAl_2相在常用硫酸电解液中阳极氧化时比铝溶解更快,引起电流集中,造成局部烧损。作者测量了铜在四种不同硫酸浓度(100g/1,200g/1,300g/1 和400g/1)电解液中的阳极极化曲线,证明了电解液中硫酸浓度增加有利于抑制铜的阳极溶解。作者也测量了铜在上述四种浓度电解液中的阳极击穿电压,确定了 LY-12铝合金(含铜3.8～4.9%)在400g/1硫酸电解液中阳极氧化获得70～80μm 均匀厚膜的工艺规范。本文还研究了 LY-12铝合金热处理状态对阳极氧化工艺的影响。
Al-Cu-Mg-based aluminum alloys with high copper content are difficult to anodize to form thick films because the S (CuMgAl 2) phase and the CuAl 2 phase precipitated in the aluminum alloy dissolve faster than aluminum in anodic oxidation in common sulfuric acid electrolytes , Causing current concentration, resulting in local burning. The authors measured the anodic polarization curve of copper in four different sulfuric acid solutions (100g / 1,200g / 1,300g / 1 and 400g / 1), demonstrating that the increase of the sulfuric acid concentration in the electrolyte favors the anodic dissolution of copper. The authors also measured the anodic breakdown voltage of copper in the above four electrolyte solutions and determined that the LY-12 aluminum alloy (3.8 to 4.9% copper) was anodized in a 400 g / l sulfuric acid electrolyte to obtain a uniform thickness of 70-80 μm Membrane process specifications. This article also studied the LY-12 aluminum alloy heat treatment on the anodizing process.