本文用ＸＲＤ、ＳＥＭ和ＴＥＭ研究了ＴｉＣ颗粒增强钨基复合材料（ＴｉＣｐ／Ｗ，ＴｉＣｐ体积分数为３０％）的组织结构。结果表明，由于ＴｉＣｐ的加入，阻碍Ｗ晶粒在烧结时的长大；复合材料的致密度较纯Ｗ的有所提高； Ｗ向ＴｉＣ晶格发生扩散，在ＴｉＣ中形成（Ｔｉ，Ｗ） Ｃ固溶体， Ｔｉ也向Ｗ中发生少量扩散．使ＴｉＣｐ／Ｗ界面形成冶金结合。在复合材料中没有发现Ｗ２Ｃ和ＷＣ相。复合材料的韧性、弹性模量和硬度都明显比纯Ｗ的高。复合材料的韧化机制是裂纹偏转和细品动化。 In this paper, the microstructure of TiC particles reinforced tungsten matrix composites (TiCp / W, TiCp volume fraction of 30%) was studied by XRD, SEM and TEM. The results show that due to the addition of TiCp, the growth of W grains during sintering is hindered. The densification degree of the composites is higher than that of the pure W. The W diffuses into the TiC lattice and forms (Ti, W) C in TiC Solid solution, Ti also W to a small amount of diffusion. The TiCp / W interface forms a metallurgical bond. No W2C and WC phases were found in the composites. The toughness, elastic modulus and hardness of composites are obviously higher than that of pure W. The toughening mechanism of composite materials is the crack deflection and the fineness of the material.