集成电路制造用溅射靶材的绑定技术,又称焊接或粘接技术,是溅射机台设计和制造工程师、溅射靶材开发生产工程师、以及集成电路制造工艺和设备工程师共同关心的问题,通过对比研究机械连接、钎焊、胶粘结、扩散焊、电子束焊和爆炸焊的应用条件和优缺点,增进溅射靶材设计、生产和使用相关工程师对靶材绑定技术的交流和认识。 Binding technology for sputtering targets in integrated circuit manufacturing, also known as soldering or bonding technology, is a common concern for sputtering machine design and manufacturing engineers, sputtering target development and production engineers, and integrated circuit manufacturing processes and equipment engineers Problem, by comparing the mechanical connection, brazing, adhesive bonding, diffusion welding, electron beam welding and explosive welding conditions and advantages and disadvantages of the promotion of sputtering target design, production and use of the relevant engineers to target binding technology Exchange and awareness.