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铜电极在KCl电解质溶液中的电化学腐蚀已有循环伏和红外光谱电化学研究,然而,腐蚀过程的动力学和机理还不十分清楚.本文以SCILAB自由软件编程的元胞自动机方法模拟了该腐蚀过程的动力学,与实验结果一致,结合红外光谱、量子化学计算结果,进一步在分子尺度上探讨铜在实验条件下的腐蚀过程的机理:腐蚀动力学曲线在较短时间(<200 s)内符合Weibull规律,较长时间(>200 s)遵循Hoerl关系.
Electrochemical corrosion of copper electrode in KCl electrolyte has been studied by cyclic voltammetry and infrared spectroscopy, however, the kinetics and mechanism of the corrosion process are not yet clear.In this paper, the cellular automata programming with SCILAB free software is used to simulate The kinetics of the corrosion process is consistent with the experimental results. The mechanism of the corrosion process of copper under experimental conditions is further discussed at the molecular scale based on infrared spectroscopy and quantum chemical calculation results. The corrosion kinetic curve is in a shorter time (<200 s ) Comply with the Weibull law, a long time (> 200 s) follow the Hoerl relationship.