本文介绍可以直接在钢铁基体上获得具有良好结合性能铜镀层的焦磷酸盐镀铜工艺。该工艺可一次镀取厚铜层,用于防护装饰性电镀或防止渗碳的镀铜;其分散能力接近于氰化工艺,并且有镀液稳定、操作简单,毋需带电下槽、临界起始电流密度低等优点。 This article describes the pyrophosphate copper plating process that achieves a good combination of copper plating on steel substrates. The process can be a thick layer of copper plating for the protection of decorative plating or prevent carburizing of copper; its decentralization capacity close to the cyanide process, and the bath is stable, easy to operate, without charged under the tank, the critical Low initial current density.