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建立了多晶硅热执行器阵列的宏模型 .利用热传导原理分析了执行器的电热特性 ,根据结构力学原理给出了执行器阵列的偏转及驱动力 .用多晶硅表面微机械加工技术制备了阵列并进行了测试 .执行器偏转的测量与实验吻合较好 .该宏模型可以用于分析、优化和设计热执行器阵列 .
A macromodel of polycrystalline silicon thermal actuator array was established. The thermal characteristics of the actuator were analyzed by thermal conduction principle, and the deflection and driving force of the actuator array were given according to the structural mechanics principle. The array was prepared by polycrystalline silicon micromachining technology The test was performed with the deflection of the actuator in good agreement with the experiment.The macro model can be used to analyze, optimize and design the thermal actuator array.