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第15届电子封装技术国际会议(ICEPT 2014)将于2014年8月12日~15日在中国成都举行。会议由中国电子学会电子制造与封装技术分会(EMPT)主办,由电子科技大学承办。ICEPT系列会议多年来得到了IEEE-CPMT的全力支持和IMAPS、ASME和iNEMI等国际著名行业组织的积极参与,并得到了中国电子学会、中国科协的高度评价,已成为国际电子封装四大品牌会议之一。
The 15th International Conference on Electronic Packaging Technology (ICEPT 2014) will be held in Chengdu, China from August 12 to 15, 2014. The conference is sponsored by the Electronic Manufacturing and Packaging Technology Branch of China Institute of Electronics (EMPT) and hosted by the University of Electronic Science and Technology of China. Over the years, the ICEPT series of conferences have received the full support of IEEE-CPMT and the active participation of internationally renowned industry organizations such as IMAPS, ASME and iNEMI. They have been highly appraised by China Institute of Electronics and China Association for Science and Technology and have become the four major international electronic packaging brands One of the meetings.