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采用光学显微镜、扫描电镜和力学性能测试等方法研究了Si含量对热挤压态Cu-15Ni-8Sn合金微观组织和力学性能的影响。结果表明:Si可细化铸态合金的枝晶间距,含Si相经过长时间的均匀化退火后仍能稳定存在于合金内;Si元素能明显抑制热挤压态合金再结晶晶粒的长大和二次再结晶过程。Si含量为0.3%时,可得到分布均匀、晶粒细小的再结晶组织,晶粒尺寸5~8μm,合金抗拉强度795 MPa,屈服强度589 MPa,伸长率31.2%,分别比不含Si的合金提高9.3%、13.1%和20.3%。
The effects of Si content on the microstructure and mechanical properties of hot-extruded Cu-15Ni-8Sn alloy were investigated by optical microscopy, scanning electron microscopy and mechanical properties testing. The results show that Si can refine the dendrite spacing of the as-cast alloy, and the Si-containing phase can stably exist in the alloy even after being homogenized for a long time. Si can significantly inhibit the growth of recrystallized grains Large and secondary recrystallization process. When the content of Si is 0.3%, the recrystallized microstructure with uniform grain size and fine grain size can be obtained. The grain size is 5 ~ 8μm, the tensile strength is 795 MPa, the yield strength is 589 MPa and the elongation is 31.2% Of the alloys increased 9.3%, 13.1% and 20.3%.