目前我国覆铜箔层压板厂已发展到60多家，其中引进的覆铜箔层压板生产线20多条，每年共需电解铜箔7000t以上，其中需高档电解铜箔4500t。随着我国电子工业的不断发展，覆铜箔压板年需求量将以较高的速度增长。报电子工业专业材料协会统计，1995年国内覆铜箔层压板需要量为5～6 At present, China’s copper clad laminate factory has grown to more than 60, of which the introduction of the copper clad laminate production line more than 20 pieces of electrolytic copper foil each year a total of more than 7000t, of which high-grade electrolytic copper foil 4500t. With the continuous development of China’s electronics industry, the annual demand for clad laminates will increase at a relatively high rate. Electronic Industry Professional Materials Association statistics, in 1995 the domestic demand for copper clad laminates 5 to 6