论文部分内容阅读
分析了硅微机械谐振式传感器在热激励下的挠曲及谐振频率变化 ,建立了相应的数学模型 ,并对热挠曲灵敏度进行了优化设计。同时通过算例和测试数据的对比 ,验证了谐振频率计算模型的正确性。
The deflection and resonance frequency change of silicon micromachined resonant sensor under thermal excitation are analyzed. The corresponding mathematical model is established and the thermal deflection sensitivity is optimized. At the same time, the correctness of the resonant frequency calculation model is verified through the comparison between the example and test data.