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聚酰亚胺膜分子自组装与激光诱导图形化学镀铜为了摒弃化学镀铜中价格昂贵、环境污染的活化工艺,将分子自组装技术与激光诱导化学镀技术结合,在聚酰亚胺薄膜(PI)上成功实现了图形化微米级金属铜沉积:将PI薄膜通过KOH溶液进行表面水
Polyimide film self-assembly and laser-induced graphitization Copper plating In order to abandon the electroless copper plating in the expensive, environmentally-friendly activation process, the molecular self-assembly technology and laser-induced electroless plating technology combined in the polyimide film PI) successfully achieved the graphical micron-scale copper deposition of the metal: the PI film was subjected to surface water with a KOH solution