在由离子注入的杂质掺杂,电极金属材料的烧结等半导体器件制作工艺中,退火是其重要的工艺之一。在半导体工艺技术的研究中,进行了大量的技术革新,并发展了许多新技术,这对现代的电子学发展作出了重大的贡献。就拿退火技术来说,自半导体器件出现以来一直是采用在电炉内加热的办法,与其它的工艺技术一样并没有发生巨大的变化。但是,最近以来,退火工艺中也开始试图引入一种新的 Annealing is one of the important processes in the fabrication of semiconductor devices such as impurity doping by ion implantation and sintering of electrode metal materials. In the research of semiconductor technology, a great deal of technological innovation has been carried out and many new technologies have been developed, which make a significant contribution to the development of modern electronics. Take annealing technology, since the advent of semiconductor devices has been used in the electric furnace heating method, and other technology, like no great changes. However, recently, attempts have been made to introduce a new type of annealing process