The wettability and bonding in Ni/Ti(C, N) systems with multiple carbide additions were studied by sessile drop technique and vacuum brazing technique, respectively. The phase characterizations of substrates and fracture surfaces were conducted by XRD. The microstructures at metal/ceramic interfaces and fracture surfaces were observed via SEM in back scattered mode and second electron mode, respectively. Furthermore, an X-ray energy-dispersive spectrometer (EDS) attached to SEM was used to study the elements diffusion in interfacial regions. The results reveal that diffusion and dissolution mechanism controlled reactive wetting takes place in the system in high temperature wetting. Results also show that the contact angles decrease with multiple carbide additions, and the effect of multiple carbide additions is stronger than that of single additions. The contact angle reaches the lowest value in the lowest TiC content case. The enhancement of the wettability is due to alloying procedure during high temperature wetting when metallic atoms diffuse into Ni phase, which decreases the interfacial energy of Ni/Ti(C, N) systems. The bonding results show that the interfacial bonding strength is higher than that of solid solutions, that makes most of the specimens fail in ceramics matrix.