一、序言从印制板出现到现在已有四十年左右的历史了。开初只是用于收音机、电视机等民用电子仪器的装配以及作为器件间的互连技术。这时主要是单面板。随着电子工业的不断发展,促进了印制板制造技术的提高。从单面板到双面板,进而发展到多层板。集成电路,特别是大规模集成电路出现以后,电子机器向高密度化、高可靠性、小型化、轻量化方向发展,要求印制板也要达到高密度、高精度、高可靠性。因此,近十几年来,印制板制造技术发展很快。从材料到设计以及制造技术都作了许多工作。从制造技术角度看,以前基本上使用的是腐蚀铜箔法,即在敷铜箔的层压板材料上,用光化学法或印刷法做出抗蚀图形,然后腐蚀掉非线路部分。因此,也可以把腐蚀法称为“减去法”。用这种方法制作印制板,精度和密度都受到限制。因为在腐蚀过程中,由于侧腐蚀,图 First, the preface From the PCB appeared until now has about 40 years of history. In the beginning, it was only used for the assembly of civil electronic instruments such as radios and television sets and as an interconnection technology between devices. At this time is mainly single panel. With the continuous development of the electronics industry, to promote the improvement of printed circuit board manufacturing technology. From single-sided to double-sided, and then developed to multilayer. After the advent of integrated circuits, especially large scale integrated circuits, the development of electronic equipment toward high density, high reliability, miniaturization and weight reduction has required high density, high precision and high reliability of printed boards. Therefore, in the past ten years, PCB manufacturing technology has developed rapidly. Much has been done from material to design and manufacturing. From the manufacturing technology point of view, the corrosion copper foil method was basically used in the past, that is, a resist pattern was formed by photochemical method or printing method on a copper-clad laminate material and then the non-line portion was etched away. Therefore, the corrosion method can also be called “subtraction method.” With this method of making printed boards, precision and density are limited. Because in the corrosion process, due to side corrosion, the figure