美国的马托克斯在一九六三年发明了离子镀技术,到了七十年代发展极为迅速,它是真空蒸发与真空溅射相结合的新工艺,兼有两者优点(即真空蒸发的沉积速率快和真空溅射的离子清洗),具有镀层粘着性强、质量好和高可靠性等许多优点。它解决了电镀层结合力和均匀性不够的缺点和电镀污染问题,也解决了真空蒸发附着力和复盖力差、真空溅射沉积速 In 1960, Matlock, which invented ion plating technology in the United States, developed extremely rapidly in the seventies. It is a new process combining vacuum evaporation and vacuum sputtering, and has the advantages of both (ie, vacuum evaporation Rapid deposition rate and vacuum sputtering ion cleaning), with coating adhesion, good quality and high reliability, and many other advantages. It solves the plating layer bonding and uniformity of shortcomings and electroplating pollution problems, but also to solve the vacuum evaporation adhesion and coverage is poor, the vacuum sputtering deposition rate