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1.DIP IC和SIP IC的拆卸此方法也适用于排阻等多引脚直插元件。(1)锡炉法。锡炉的特点是熔炉槽可以升降,且体积小。把印制板平放在锡炉上,元件面朝上,待拆卸元件的引脚位置刚好在槽内,其余元件的引脚在槽外。加热,使熔化的锡往上涌起,用IC起拔器就可以轻而易举地把IC取出来。此
1.DIP IC and SIP IC disassembly This method also applies to exclusion and other multi-pin line components. (1) tin furnace method. The characteristic of the tin stove is the furnace tank can be raised and lowered, and the volume is small. The printed circuit board flat on the tin stove, components face up, the pin to be removed components position just in the slot, the remaining components of the pin outside the slot. Heating, so that the melting of the upside up tin, with IC puller can easily remove the IC. this