为了研究Z-pin层间增强的影响因素,采用Z-pin-浇注体拔脱实验分析了Z-pin埋入深度、直径和固化度对其拔脱性能的影响。采用Z-pin-浇注体与层合板的对比拔脱实验验证了Z-pin-浇注体拔脱实验表征Z-pin与被增强体的结合状态的可行性。Z-pin-浇注体拔脱实验结果表明,Z-pin的最大拔脱力随着埋入深度的增加而非线性增加;直径对拔脱力的影响主要体现在总接触面积的改变,最大拔脱力与Z-pin直径呈线性关系,其中直径0.7mm Z-pin的最大拔脱力是直径0.3mm Z-pin的2.35倍;控制Z-pin固化度,利用其与基体的共固化效应可以大幅地提高界面剪切强度,失效模式从界面脱粘转变成界面脱粘和基体树脂的内聚破坏的混合模式,最大拔脱力最高可以提高17倍。 In order to study the influence factors of Z-pin interlayer enhancement, the influence of Z-pin embedding depth, diameter and curing degree on the pull-out performance was analyzed by Z-pin-casting body pull-out experiment. The comparison of the Z-pin-gating with the laminates shows that the Z-pin-gating body experiment can be used to characterize the binding between the Z-pin and the reinforced body. The results of Z-pin-casting body pull-out experiment show that the maximum pull-out force of Z-pin increases non-linearly with the increase of buried depth. The influence of diameter on pull-off force is mainly reflected in the change of total contact area, Z-pin diameter is a linear relationship, in which the maximum diameter of 0.7mm Z-pin pull-off force is 2.35 times the diameter of 0.3mm Z-pin; control Z-pin curing degree, the use of its co-curing effect with the substrate can greatly improve the interface Shear strength, failure mode from the interfacial debonding into interfacial debonding and matrix resin cohesion failure mixed mode, the maximum pull-off can be increased up to 17 times.