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随着微电子产品 ,特别是便携式装置、汽车电子和消费类电子产品轻、薄、短、小化的发展 ,并基于成本、性能和可靠性等方面的考虑 ,本文通过对各类封装技术的特点比较 ,阐述了圆片级封装技术 (WLP)的优势 ,在当前封装领域所占的重要位置 ,以及在未来的几年内会继续保持很高的增长速度 ,在低中等I/O端数的IC装封市场中 ,将会占据越来越大的份额。
With the development of light, thin, short and small electronic products, especially portable devices, automotive electronics and consumer electronics products, and based on cost, performance and reliability considerations, this paper through the various types of packaging technology The features are compared to illustrate the benefits of wafer level packaging (WLP), an important place in the current packaging arena, and will continue to grow very fast in the coming years, with low I / O count ICs Packed in the market, will occupy an increasing share.